2024 IEEE IEDM Call for Papers

The Annual IEEE International Electron Devices Meeting will be held at the Hilton San Francisco Union Square in San Francisco, CA, from December 7-11, 2024.

Key Dates

  • Submission Deadline: Thursday, July 11, 2024 23:59 PDT

  • Late News Submission Deadline: August 19, 2024 23:59 PDT

The paper submission deadline is July 11 for submission of four-page, camera-ready papers to provide faster dissemination of the conference’s cutting-edge results. Accepted papers will be published as-is in the proceedings.

Submit Paper Focused Call for Papers Main Call for Papers


ADVANCED LOGIC TECHNOLOGY (ALT)

Typical Themes

  • CMOS platform technologies & opportunities

  • Logic device performance and circuit design challenges

  • Advanced, novel process integration schemes and (applications-driven) scaling approaches

  • Process module innovations and progresses in process control & process metrology

  • Device technology co-optimization (DTCO), System technology co-optimization (STCO)

New or Trending Areas

  • GAA (vertically stacked) nanosheets based devices and circuits; new channel materials

  • Sequential, monolithic 3D integration, heterogenous chiplets, 2.5/3D integration, thermal management

  • Logic for memory

  • Interconnects (BEOL, Backside power delivery)

  • BEOL compatible transistors

EMERGING DEVICE and COMPUTE TECHNOLOGY (EDT)

Typical Themes

  • 2D and devices on low-dimensional materials

  • Non-CMOS emerging devices

  • Neuromorphic and approximate computing devices

  • Spintronic and magnetic devices

  • Steep-slope devices

  • Quantum computing devices

New or Trending Areas

  • Topological materials and devices, and phase transitions transistors

  • Emerging state machines, time dynamical systems, approximate computing

  • Novel cryogenic devices

MEMORY TECHNOLOGY (MT)

Typical Themes

  • Conventional memories

  • Emerging memories

  • 3D memory technologies

  • Memories for AI and near-memory computing applications

  • In-Package memory for PPA augmentation

New or Trending Areas

  • Memories to break the memory wall

  • Memory-enabled artificial intelligence applications

  • Memory-logic 3D stacking

  • System-technology co-optimization

  • Memory pooling and communication

  • New memory hierarchy

MODELING AND SIMULATION (MS)

Typical Themes

  • Technology CAD and benchmarking

  • Advanced logic and memory device modeling

  • Atomistic material, process, and interconnect simulation

  • Compact models for DTCO

  • Alternative computing device modeling

  • Nanoscale (bio) sensors modeling

Typical Themes

  • SRAM, DRAM, Flash, ReRAM, MRAM, PCRAM, ferroelectric memory, and memory selector for analog in-memory deep learning

  • Memory, logic, and nanoelectronic devices with novel functions and/or materials for new and unconventional compute paradigms

  • Probabilistic and approximate computing enabled by stochastic behaviors of devices and materials

  • Emerging computing algorithms enabled by memory, logic, and nanoelectronic devices

New or Trending Areas

  • Multi-scale simulation with hybrid techniques

  • Advanced packaging and 3D integration modeling

  • Thermal modeling

  • Low-temperature and quantum device modeling

  • Device modeling for photonics

  • Device modeling for in-memory and in-sensor computing

NEUROMORPHIC and NOVEL COMPUTING (NC)

New or Trending Areas

  • Device-algorithm co-optimization

  • Monolithic 3D integration for neuromorphic computing

  • Neuromorphic sensors and in-sensor computing

OPTOELECTRONICS, DISPLAYS, and IMAGING SYSTEMS (ODI)

Typical Themes

  • Heterogeneous optoelectronic integration including sources, modulators or detectors

  • Neuromorphic photonics

  • Single photon emitters and detectors

  • Luminescent devices based on new materials including perovskites and quantum dots

  • Displays and imagers for augmented or virtual reality

  • Holographic devices and displays

  • Displays with unconventional form or size

  • Photodetectors and imagers with new materials or flexible platform and printed electronics

  • Imagers with unconventional spectral bandwidth, high sensitivity, or high time-resolution

  • Image sensors with pixels for range sensing, TOF, RGBZ, LIDAR

New or Trending Areas

  • Photonic devices for quantum computation and sensing

  • Intelligent Image sensors

  • Advanced on-chip optics for imagers

  • In-display and under-display sensors

POWER, MILLIMETER WAVE AND ANALOG TECHNOLOGY (PMA)

Typical Themes

  • Power and/or high speed (microwave to THz devices) devices, modules, and systems

  • Manufacturing processes, device design, modeling, physics, and reliability of power and/or high-speed devices

  • Fundamental studies on doping, traps, interface states, and device reliability for power and/or high-speed switching devices

  • Micro and mm-wave devices, such as PAs, LNAs, switches and mixers.

  • Energy harvesting devices and circuits

  • Tunable passives, SAW/BAW devices, antenna arrays

New or Trending Areas

  • Wide bandgap and ultra-wide bandgap semiconductors such as SiC, (Al)GaN, diamond, β-Ga2O3, BN
  • Power devices for applications for automotive and aviation to smart grid
  • Device and circuits for 5G and 6G
  • Antenna arrays and beam forming
  • Extreme environment power and high-speed devices
  • kt2 of ScxAl1−xN piezoelectric material: LNO, LTO, AIN(Sc)…

RELIABILITY OF SYSTEMS and DEVICES (RSD)

Typical Themes

  • Component level of FEOL/MEOL/BEOL reliability model

  • Robustness and security of electronic circuits and systems

  • Reliability of conventional and emerging memories

  • Circuits, systems-level reliability, and aging

  • Thermal and PID/charging management in existing and novel process integration

  • Reliability of RF/mm-wave/5G in high-frequency

    applications

  • Reliability of devices, circuits, and systems for more-than-Moore applications, automotive, aerospace and bio-applications (BioFETs, DNA detection, etc.)

  • Reliability of cryogenic devices for future quantum

    computing applications

New or Trending Areas

  • Reliability of new materials and/or new architectures for transistors

  • Reliability of advanced 2.5D/3D IC advanced package

  • Design for testing (DFT) / Design for reliability (DFR) solutions for improved reliability

SENSORS, MEMS, and BIOELECTRONICS (SMB)

Typical Themes

  • Physical and biochemical integrated sensors

  • Energy harvesting and storage devices

  • Flexible devices for wearable applications

  • MEMS for Internet of Things

  • Bio-electronic interfaces and implantable devices

New or Trending Areas

  • Intelligent sensors with embedded AI

  • Multimodal biochemical and physical sensors for healthcare

  • Sensors and devices for human-machine interface

  • Hybrid organic/inorganic microfabrication and device