They come in axial-lead (B41699) and soldering star (B41799, see photo) types, rated to 25 or 35V, with capacitance ranging from 1,800 to 13,000µF.
These are branded as “ultra compact” by the company.
Picking a mid-range example, 4,700μF types have a body size of 18 x 30mm (dia x length) for the 25V version and 21 x 30mm for the 35V version. Overall, bodies range from 16 x 25mm to 21 x 49mm.
“They offer ripple currents of up to 34.6A at 10kHz and +125°C case temperature, supported by over 4,000 hours of useful life at +125°C at rated voltage and rated ripple current, and vibration stability up to 60g is available upon request,” said the company. “This robustness is particularly advantageous in xEV platforms operating within a 12V board net, where thermal stress, mechanical vibration and compact integration are critical design factors.”
Vibration here is rated with the case supported by a clamp.
Storage is possible for up to 15 years at 35°C and they comply with AEC-Q200.
Find the combined B41699 and B41799 data sheet on this TDK web page.
