This new partnership brings together Ayar Labs’ CPO technology, Alchip’s advanced packaging expertise, and TSMC’s packaging and process technologies to build a robust ecosystem to accelerate the production and adoption of optical engines.
“By combining our optical I/O innovation with Alchip’s deep expertise in advanced packaging, we’re building an ecosystem to accelerate the transition to power-efficient, high-performance AI systems,” says Ayar CEO Mark Wade.
“Current and future AI workloads require innovative and often collaborative advanced packaging design expertise and production-ready solutions. Alchip has proven to the market that it has the entire skill set to serve tier 1 hyperscale customers,” said Johnny Shen, chairman and CEO of Alchip Technologies. “We’re working with Ayar Labs to bring leading edge optical I/O technology to demanding high-performance next-gen designs, helping hyperscalers achieve new levels of data throughput and energy efficiency.”
Using TSMC’s packaging and silicon technologies, including COUPE™, TSMC-SoIC®, and advanced process nodes, Ayar Labs and Alchip are addressing critical data movement bottlenecks and enabling new system architectures. The result is a scalable, repeatable path for next-generation AI infrastructure CPO adoption.
Ayar Labs and Alchip will share additional details on their partnership and joint CPO solutions for AI datacentre scale-up in the coming weeks
