The devices come i in 9×9 mm packaging, the smallest package available for AMD 16nm SoCs.
It is also available in a “flip-chip” scale package, designed for increased routing/signal density for I/Os, better solder joint reliability, and enhanced electrical performance.
Artix UltraScale+ devices extend the AMD portfolio of automotive-grade, safe, and highly scalable FPGA and adaptive SoCs, Spartan 7, Zynq 7000, and Zynq UltraScale+ product families.
“As the automotive market expands, optimising form factor, power, and image and video processing has become even more critical for automotive OEMs and Tier 1 suppliers,” says AMD’s Wayne Lyons,“with the release of the new small-form-factor Artix UltraScale+ device, AMD continues its commitment to developing devices to address ADAS & IVI synergy.”
Available now, the FPGAs offer signal compute density & optimised I/O in the smallest form factor in the AMD auto portfolio.
