ECTC 2026 will take place May 26-29, 2026 at the Ritz-Carlton Grande Lakes Resort in Orlando, FL. More than 2,000 scientists, engineers and business people from more than 20 countries are expected to attend.
For all details and to submit an abstract: ECTC 2026 Call for Papers.
The ECTC 2026 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, chiplet architectures, hybrid bonding, WLP and PLP, fan-out and fan-in packaging, flip-chip technologies, integrated photonics and optoelectronics, LEDs, 5G, quantum computing and systems, and other emerging technologies in electronics packaging.
Previously unpublished, non-commercial paper abstracts are requested in areas including:
- Applied Reliability
- Assembly and Manufacturing Technology
- Electrical Design and Analysis
- Emerging Technologies
- Interconnections
- RF, High-Speed Components & Systems
- Materials & Processing
- Thermal/Mechanical Simulation & Characterization
- Packaging Technologies
- Photonics
- Interactive Presentations
