In 2022 it raised $40 million from investors which included the venture arms of Intel and Micron and, in March this year, it raised another $60 million in a round co-led by Samsung Catalyst Fund and Tiger Global Management.
Other investors have been: Celesta Capital, Cleveland Avenue, Mesh Ventures, Micron Ventures,, SK hynix, and Tracker Capital Management.
The funds will be used to grow the company’s corporate infrastructure in sales, marketing and administration, as well as evolve its product line to address existing and new opportunities in die-to-die (D2D), die-to-memory (D2M), chip-to-chip (C2C) interconnect and develop its series of custom and standard memory and IO subsystem chiplets.
“We have entered a new phase in the company’s evolution as we ready our first products for commercialisation while in parallel are seeing increasing demand for our approach to enable high-performance, power efficient interconnect in multi-die architectures,” says CEO Ramin Farjadrad.
