Connectors and interconnect solutions ensure that various components and devices communicate efficiently. As technology progresses, the demand for more reliable, versatile, and robust connectors grows. Four newly launched connectivity solutions from CUI Devices, TE Connectivity, Attend, and Mobix Labs exemplify how interconnects are constantly evolving to meet the ever-changing demands of the electronics sector.
CUI Devices Announces New D-Coded Circular Connectors
CUI Devices has expanded its product line to include M12 connectors with D coding, enhancing its circular connectors and cable assemblies. D coding refers to the specific configuration and pin arrangement within the M12 connector, designed to support Ethernet applications. This configuration offers robust performance for data transmission up to 100 Mbps and provides secure and reliable data connections even in harsh environments.
CUI’s CDM12 family includes male and female jack or plug versions (datasheets linked) with four-pin contact position options. They are IP67-rated for industrial and factory automation applications. Moreover, the rugged circular design can withstand exposure to dust, moisture, and vibrations common in industrial settings. The new connector models are available in panel mount packages featuring PC pin or wire lead terminations and come in M12 x 1.0, M16 x 1.5, or PG9 thread sizes. They are enclosed in PVC or PUR jacket materials with copper alloy screw terminals, offering straight or right-angle orientations with cable lengths ranging from 0.5 to 5 meters.
The D-coded connector models. Image used courtesy of CUI Devices
These cables provide a blunt-cut cable end or an RJ45 plug connector option. Additionally, they have an operating temperature range of -25°C to 80°C, voltage ratings of 60 Vac or 250 Vac, and current ratings of 1.5 A or 4 A.
TE Connectivity Introduces New High-Density Optical Interconnect Modules
TE Connectivity has added new VITA 66.5 Style D optical modules to its VITA 66 optical backplane interconnect family. The company designed these optical modules (datasheet linked) to meet the needs of modern embedded computing.
Optical interconnects are inherently superior to traditional copper-based solutions in handling large volumes of data quickly and efficiently. The new interconnect modules support higher data rates to ensure seamless communication without bottlenecks. They offer a robust, blind-mate optical interconnect solution for aerospace, defense, and marine applications.
The VITA 66.5 Style D optical modules. Image used courtesy of TE Connectivity
Featuring up to three MT ferrules per insert and a floating receptacle design, these modules provide optimal alignment and high performance. They come in both full-size and half-size configurations, enabling flexibility in various system designs. They can be easily integrated with standard mounting interfaces for 3U and 6U VPX applications. Their floating alignment capability also improves performance by ensuring precise connections—a key feature for maintaining high data rates and bandwidth. These features make them suitable for applications like embedded computing, secure communications, avionics, radar, and imaging systems.
Attend Reveals Compact 2-in-1 Stacked Card Connector
Attend has introduced a space-efficient, 2-in-1 stacked card connector compatible with Micro SD, Nano-SIM, and Micro SIM cards to ensure smooth data transfer and optimize PCB space. It features a vertical stacking design that saves up to 50% PCB space compared to traditional dual-card connectors, according to Attend. Its customizable tray lengths enable manufacturers to vertically stack the cards. These space-saving features make this connector (datasheet linked) well-suited for applications in industrial automation, IoT deployments, and rugged portable equipment, where robust performance and versatile options are essential.
Attend’s new 2-in-1 stacked card connector. Image (modified) used courtesy of Attend
One of the main features of this card connector is its anti-reverse protection for card detection and tray insertion. It is a robust tray lock function that guards against shock and vibration. The connector is tested to withstand 5,000 mating cycles and operates within a wide temperature range from -40°C to +105°C. Furthermore, it meets the EN60721-3-5 Class 5M3 random vibration and Level II shock test standards, ensuring its reliability in harsh conditions.
Mobix Labs Shows Off EMI-Filtered Connectors
Finally, Mobix Labs unveiled its new electromagnetic interference (EMI)-filtered ARINC 404 and ARINC 600 connectors for defense and aerospace applications. They are customizable with planar arrays, ceramic Pi Tubes, or chip capacitors to meet military specifications and ensure high performance.
EMI filtered ARINC connector. Image used courtesy of Mobix Labs
The importance of EMI filtering in connectors extends to enhancing the overall reliability and safety of defense and aerospace technologies. These connectors ensure that sensitive equipment remains operational in environments where electromagnetic interference is prevalent, thus supporting the robust performance of mission-critical systems. The new connectors offer insertion loss of 70-80 dB for Pi filters and 50-60 dB for C filters, which is useful for these demanding applications.
