A crop of new embedded boards from Congatec, ASRock Industrial, and Advantech have hit the market, offering significant advancements in performance and versatility. With powerful processors, enhanced artificial intelligence (AI) capabilities, and robust connectivity, these boards are poised to drive the next generation of modern applications and edge computing solutions.
Congatec’s SMARC Modules for Edge AI
Congatec has announced new computer-on-modules (COMs) featuring NXP’s i.MX 95 processors. These modules focus on high performance, scalability, and energy efficiency, making them suitable for edge AI applications. The Conga-SMX95 SMARC 2.1 uses four to six Arm Cortex-A55 cores and integrates the new Arm Mali 3D graphics unit to provide up to 3x the graphical processing unit (GPU) performance of their predecessors. These graphical capabilities are complemented by NXP’s eIQ Neutron neural processing unit (NPU), which doubles the AI inference performance.
Congatec’s new SMARC module. Image used courtesy of Congatec
The modules feature 2x the Gbit Ethernet with time-sensitive networking (TSN) for synchronized network data transmission. They also support LPDDR5 memory with inline error correction code (ECC) for data security. The modules offer both DisplayPort and low-voltage differential signaling (LVDS) interfaces for display connectivity and include two MIPI-CSI interfaces for direct camera connectivity.
These capabilities—and their ability to perform on-device, AI-accelerated workloads—make them useful for machine vision, visual inspection, and robotics applications. They are also well-suited for AI-accelerated, low-power applications in industrial production, rugged human-machine interfaces (HMIs), 3D printing, and medical imaging. Designers can leverage their AI inferencing ability for autonomous mobile robots (AMR) and automated guided vehicles (AGV), where real-time decision-making is crucial.
ASRock’s New Industrial Motherboards
ASRock Industrial has unveiled two Mini-ITX industrial motherboards, the IMB-A8000 and IMB-A1002. These boards target edge AI applications ranging from smart manufacturing and robotic control to machine vision, smart retail, transportation, and city infrastructure.
The IMB-A8000 Mini-ITX motherboard incorporates the AMD Ryzen Embedded 8000 series accelerated processing unit (APU), boasting up to eight cores/16 threads and a 4-nm processor. It features an integrated AMD Radeon graphics unit and an XNDA NPU that delivers 16 TOPs for AI inferencing. It supports high-speed, dual-channel DDR5-5,600 MHz memory up to 96 GB, ensuring efficient multitasking and data processing. Additionally, it supports 4K quad-displays via four DP 1.4a outputs and includes triple storage options with one M.2 Key M (2242/2280) with PCIe Gen4x4 and two SATA3 ports.
The IMB-A8000 and IMB-A1002 industrial motherboards. Image used courtesy of ASRock Industrial
The IMB-A1002 Mini-ITX motherboard, powered by the AMD Ryzen Embedded 7000 series APU, offers up to 12 cores/24 threads and supports the AM5 socket with B650 chipset. It integrates AMD Radeon graphics and supports dual-channel DDR5-5,200 MHz memory up to 64 GB. For display options, it supports 4K quad-displays with three DP 1.2 and one eDP 1.4b. The IMB-A1002 also provides robust storage solutions with one M.2 Key M with PCIe Gen4x4 and two SATA3 ports. ASRock Industrial claims the motherboard bolsters security with an onboard trusted platform module (TPM) 2.0.
Advantech’s New Mini- ITX Board Based on Intel Atom
Advantech’s AIMB-219 is a Thin Mini-ITX board supporting a range of processors, including Atom N-series, Atom x7000RE, and Intel Core i3 N-series. Notably, the Intel Core i3-N305 offers a 2.5x increase in computing performance and a 2x improvement in graphics compared to its predecessor. With up to eight cores and a burst frequency of 3.8 GHz, it efficiently balances power and performance, all while maintaining a thermal design power (TDP) of under 15 W.
One of the standout features of the AIMB-219 is its wide operating temperature range of -20°C to 70°C, coupled with a fanless design that ensures quiet and stable operation. These features make it particularly suited for environments where noise reduction is crucial, such as digital signage and medical devices. The fanless thermal management also makes the board compact. In addition, the board’s components are selected for their resilience to extreme temperatures, making it reliable for factory automation and outdoor kiosks where temperature fluctuations are usual.
The AIMB-219 THIN mini-ITX board. Image used courtesy of Advantech
It supports triple independent displays with outputs including DP over USB Type-C, HDMI up to 4K, and LVDS or eDP, ensuring high visual performance for applications like outdoor signage and kiosks. It also offers a variety of I/O options, such as three USB 3.2 Gen 2, five USB 2.0, one USB Type-C, and six COM ports. Additionally, it features M.2 B-Key and E-Key slots for wireless connections, simplifying mobile device deployment and enhancing system integration.
SMARC vs. Mini-ITX vs. Thin Mini-ITX Form Factors
Congatec, ASRock Industries, and Advantech have unveiled products with three different form factors: SMARC, Mini-ITX, and Thin Mini-ITX, respectively.
The SMARC modules are small and modular, often requiring a carrier board for connectivity options. Their key advantage is low power consumption and portability. The Mini-ITX boards are slightly larger and designed as complete motherboards, offering a good balance between expandability and performance. The Thin Mini-ITX maintains the same footprint as the Mini-ITX but is significantly slimmer. While its low-profile design makes it useful for applications where space is tight, it may limit the expansion capabilities.
