It comes on top of the $2.18 billion it has already received from the government.
$330 million of the latest funding round is earmarked for back-end R&D.
Rapidus is working with IBM, Imec and Leti on installing a 2nm prototype line by 2025, a volume 2nm process by 2027 and a 1.4nm process by 2028. The processes will be installed at the company’s Hokkaido fab
It has research collaborations with the universities of Tokyo and Tohoku.
Rapidus is backed by eight Japanese companies – Toyota, Sony, NTT, SoftBank, Kioxia, Denso, NEC and MUFG Bank.
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