Despite the slowdown, the automotive & mobility segment is expected to retain about 70% of SiC demand over the next 5 years. Yole also sees a: $200 million market opportunity for SiC in datacentres.
Automotive momentum continues with high-voltage automotive platforms. More 800V EV model launches result in higher SiC adoption than with 400V fleets.
Industrial applications, ranging from EV chargers to photovoltaics and high-power data centers, are also increasingly integrating SiC technologies.
“SiC is entering a new phase of maturity,” says Yole’s Poshun Chiu, “despite short-term volatility, long-term growth remains robust, with automotive electrification and industrial diversification as its twin engines.
The transition to 8″ SiC wafers progressed significantly in 2024. Wolfspeed became the first to generate more revenue from 8″ than 6″, while Infineon and Bosch are entering production in 2025. Qualification activities are ongoing across the industry, aiming for broader deployment by 2026.
Supply-wise, 8″ wafer availability has improved thanks to players like SICC, which now delivers in high volume to the open market. Wolfspeed has also announced its intent to supply 8″ wafers externally.
As of 2025, the IDM model dominates, integrating design, device manufacturing, and packaging to align with the stringent requirements of automotive customers. Internally managed wafer capacity is becoming a strategic priority to support R&D and mitigate geopolitical uncertainties.
Additionally, 12″ SiC wafers have been demonstrated by multiple Chinese wafer suppliers. However, this does not target platforms for device manufacturing, as the 8″ transition will still take time to ramp up. The positive side of the massive capacity build-up at the wafer level is the opening of opportunities to use SiC in new applications, such as AR/VR glasses..
Announcements of global investment in SiC have exceeded $30 billion, with significant initiatives in the US, Europe, and Asia, particularly in Japan and China, which is accelerating domestic device production.
International players, such as STMicroelectronics and Infineon Technologies, are expanding into Southeast Asia, while also forming joint ventures in China.
Meanwhile, foundry participation remains small (single-digit share of device revenue) but is growing. With new entrants and 8″ lines announced, the foundry segment is set to expand, particularly as SiC moves deeper into industrial, datacom, and consumer applications, though IDMs will remain dominant for the foreseeable future.
