All of them are silicones which pour with a standard viscosity of under 5,000mPa·s, suiting them to potting small cavities or complex geometries while rejecting bubbles.
They are:
- 22106 FL – 0.5W/m/K thermal conductivity, 1.38g/cm3 density
“when heat dissipation is a must but the focus is on low material density as a way to save weight” - 22102 FL: 1W/m/K thermal conductivity, 1.68g/cm3 density
“when good heat dissipation is needed” - 22105 FL: 1.5 W/m/K thermal conductivity, 2.61g/cm3 density
“when the application calls for both high temperature resistance and above-average heat dissipation”
Hardness is around 60 Shore 00 with excellent vibration or shock damping, said the company, they have good basic adhesion and elongation-at-break is >100%.
Long term temperature capability is between 180 and 200°C depending on the type.
The company notes that thermal diffusivity and conductivity were measured according to DIN EN ISO 22007-2:2015-12 using the hot disc method, which is carried out without pressure – in contrast to the ASTM D5470-12 method. “Due to the ultra-soft consistency of the material, significantly higher values could be achieved using the ASTM method, however, these cannot be achieved in the potted state without pressure on the potting compound.”
Applications are foreseen in EMI filters, PFC circuits and ECUs for trains and vehicles.
