It is aimed at “high frequency power applications ranging from 3kW to 11 kW power stack designs [in] industrial power supplies, electric vehicle charging stations and on-board chargers,” according to Nexperia. It “has a low inductance package and it has been qualified to operate with a junction temperature of up to 175°C”.
The package is designed for top-side cooling and has a integrated temperature sensor.
Beyond the above, and its 28 x 22mm footprint and 6mm thickness, little else has been revealed – Electronics Weekly has asked for further specifications.
Samples are scheduled for the first quarter of 2024.
The package was developed by Kyocera in Salzburg.
